3481 · OSAT & Substrates · Panel-Level Packaging / Glass Substrate · TWSE · par NT$ 10
One of Taiwan's two large TFT-LCD panel makers, extending its large-area glass-processing capability into advanced semiconductor packaging via Fan-Out Panel-Level Packaging (FOPLP) and through-glass-via (TGV) glass-core substrates. The panel-level format positions it as a substrate supplier for high-performance and AI-accelerator chip packaging, where large rectangular panels offer area and cost advantages over wafer-level approaches.